Edge-emitting laser diodes generate extremely high optical intensity at the front facet, causing excessive heat buildup and surface defects from dangling bonds, dislocations, and native oxides. These defects absorb photons, triggering a thermal runaway effect that shrinks the bandgap, amplifies absorption, and ultimately results in Catastrophic Optical Mirror Damage (COMD), where the facet melts.
Raising the COMD power threshold is, therefore, a key priority for laser manufacturers.
Traditional passivation methods involve cleaving laser bars in ultra-high vacuum (UHV) conditions, followed by passivation with a protective layer, such as ZnSe, before depositing mirror layers. While effective, this process is costly and complex.
With our innovative solution, however, laser bars are cleaved in ambient air, followed by our unique passivation process in highly controlled conditions. This approach delivers results comparable to leading methods at a significantly lower cost.
Kontrox technology enhances surface quality, as evidenced by increased photoluminescence emission directly from the laser facet.
​Kontrox LASE 16: Redefining Laser Passivation Excellence
TM
The Kontrox LASE 16 passivation machine marks a major leap forward in semiconductor processing for laser diodes. Utilizing high-precision plasma, it effectively removes impurities from the facet, creating an optimal surface for our unique, patented nanoengineering method.
Our innovative process, powered by Kontrox , harnesses the natural oxidation of the facet to form a stable crystalline oxide barrier that protects against further oxidation and contamination, achieving performance comparable to leading industry techniques like ZnSe.
Designed as a compact, user-friendly ultra-high vacuum chamber, the Kontrox LASE 16 offers a cost-effective and simplified solution for manufacturers looking to enhance their laser diode production. This turnkey alternative delivers results on par with existing methods while alleviating the economic and operational burdens associated with traditional techniques.
TM
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Premium passivation quality at low cost, with exceptional value-to-cost ratio​
Optimized multi-process in single chamber:​
​​Cleaning
Passivation
Sealing
High throughput for mass production, up to
1,800 laser bars per day with 8 stacking jigs​
Enhanced facet stability removes time constraints and boosts flexibility for mirror coatings process​
Unique process recipes customized for customer-specific devices​
Base Pressure: 10 mbar​
XYZ Motion Resolution: 10µm
Rotation: 0,1Ëš
Pumping Speed: 680 l/s for N2
Dimensions (Main Chambers): 2.5m X 1.6m
Dimensions (Electronics Cabinet): 0.6m x 0.9m
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