Effective passivation of laser facets is the key to obtaining
the highest power output of
edge-emitting lasers
Quality passivation of the laser facets increases the power threshold of the COD
Edge-emitting laser diodes emit very high optical powers from small emission areas, therefore, the optical intensity at the front facet is extremely high. A lot of heat is created in the front facet, where (in addition to normal operation) large numbers of photons are absorbed by different defects, including dangling bonds, threading dislocations, amorphous native oxides, or in short, high level of surface states defects.
​
This absorption leads to heating of the semiconductor, which shrinks the LD bandgap, resulting in an ever-increased absorption and a further shrinkage of the bandgap. This thermal runaway process melts the semiconductor in Catastrophic Optical Damage (COD). Increasing the power threshold at which the COD happens is an important goal for laser manufacturers.
Currently, a method that provides the best passivating effect is cleaving laser bars in UHV conditions followed by passivating protection, i.e. ZnSe layer, prior to the deposition of the mirror layers. A significant disadvantage of the approach is the complex and very costly implementation of the cleaving step performed in the UHV.
​
With our novel solution laser bars are cleaved in-air, after which they are treated with an optimized in-situ cleaning process. Once a good clean facet is obtained, the laser bars are passivated in highly controlled conditions before applying the mirror coatings. This way, we achieve results similar to the best processes currently available in the market at significantly reduced costs.
Kontrox increases photoluminescence emission intensity monitored directly from the laser facet active area indicating the improvement of surface quality enabled by Kontrox.
Turnkey passivation equipment for edge-emitting lasers
.png)
​Kontrox LASE 16 — Redefining Laser Passivation Excellence
TM
The Kontrox LASE 16 passivation machine marks a major leap forward in semiconductor processing for laser diodes. Utilizing high-precision plasma, it effectively removes impurities from the facet, creating an optimal surface for our unique, patented nanoengineering method.
Our innovative process, powered by Kontrox , harnesses the natural oxidation of the facet to form a stable crystalline oxide barrier that protects against further oxidation and contamination, achieving performance comparable to leading industry techniques like ZnSe.
Designed as a compact, user-friendly ultra-high vacuum chamber, the Kontrox LASE 16 offers a cost-effective and simplified solution for manufacturers looking to enhance their laser diode production. This turnkey alternative delivers results on par with existing methods while alleviating the economic and operational burdens associated with traditional techniques.
TM
_JPG.jpg)
Product Features:
Premium passivation quality at low cost, with exceptional value-to-cost ratio​
Optimized multi-process in single chamber:​
Cleaning Passivation Sealing
High throughput for mass production, up to
1,800 laser bars per day with 8 stacking jigs​
Enhanced facet stability removes time constraints and boosts flexibility for mirror coatings process​
Unique process recipes customized for customer-specific devices​
Configurations:
-
Base pressure: 10-10 mbar​
-
XYZ motion resolution: 10µm
-
Rotation: 0,1Ëš
-
Pumping speed: 680l/s for N2
-
External dimensions: 2.5m X 1.6m
-
Internal dimensions: 2.0m x 0.8m
.png)
